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Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages
Authors
 Petrosyants K.O.
 Rjabov N.I.
Date of publication
 2020
Type of work
 статья в научном журнале
Library reference
 Petrosyants K.O., Rjabov N.I. Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages. Energies. 2020. Т. 13. №. 12. P. 3054. Doi 10.3390/en13123054
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