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Quasi-3D approach for BGA Package Thermal Modeling
Authors
 Петросянц К.О.
 Рябов Н.И.
Date of publication
 2012
Type of work
 текст доклада на конференции
Library reference
 Петросянц К.О., Рябов Н.И. Quasi-3D approach for BGA Package Thermal Modeling. 18th International Workshop on Thermal Investigation of ICs and Systems. Collection of Presented Papers. Budapest, Hungary, 25–27 September 2012. P. 158–161.
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