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Experimental Investigation of Temperature-Current Rise in Fine PCB Copper Traces on Polyimide, Aluminium and Ceramic (Al2O3) Substrates
Authors
 Petrosyants K.O.
 Popov D.A.
Date of publication
 2013
Type of work
 текст доклада на конференции
Library reference
 Petrosyants K.O., Popov D.A. Experimental Investigation of Temperature-Current Rise in Fine PCB Copper Traces on Polyimide, Aluminium and Ceramic (Al2O3) Substrates. Proc of the 2013 World Congress on Industrial Materials -Applications, Products, and Technologies (WCIM2013). Beijing, China. April 1-2, 2013.
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